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Jensen Huang Visits China with Trump: High-End AI Chip Deadlock to Ease, Liquid Cooling Cleanliness Booms

Jensen Huang Visits China with Trump: High-End AI Chip Deadlock to Ease, Liquid Cooling Cleanliness Booms

May 13, 2026

Jensen Huang Visits China with Trump: High-End AI Chip Deadlock to Ease, Liquid Cooling Cleanliness Booms

 

According to media reports on May 13, Jensen Huang, Chief Executive Officer of NVIDIA, has confirmed that he will join the delegation led by U.S. President Donald Trump for the visit to China. External analysis indicates that Huang's participation sends a positive signal, and substantial progress is expected to be made in the once-stalled trade of high-end H200 artificial intelligence (AI) chips with China.

 

 

A NVIDIA spokesperson responded that Huang's participation in the summit is at the invitation of President Trump, with the aim of supporting the achievement of relevant U.S. objectives. For its part, the White House stated that adjustments have been made to Huang's schedule, and his accompanying visit serves the mutual interests of both sides.

 

The sudden adjustment to Huang's itinerary has triggered optimistic market expectations for resolving the deadlock in high-end chip exports. As a focal point in China-U.S. science and technology trade, the market access issue of H200 chips has drawn extensive attention. Previously, the Chinese market contributed approximately

 

13% of NVIDIA's annual revenue. Although the U.S. side formally approved the sales of H200 chips to China at the end of last year and in January this year, no chips have been officially delivered to Chinese customers so far due to procedural obstacles including additional restrictions, discrepancies in transaction terms and administrative approval.

 

Relevant principals from multiple large Chinese cloud computing companies and server manufacturers stated that Huang's accompanying visit is a clear turning point signal, which is expected to promote the long-stalled procurement process. U.S. Secretary of Commerce Howard Lutnick previously pointed out that administrative approval procedures are the main factor leading to the slow progress of relevant trade.

 

With the explosion of AI computing power and the rise of the new energy industry, liquid cooling heat dissipation technology, by virtue of its superior thermal management capability, is becoming a core standard configuration in fields such as data centers and energy storage systems. However, the microchannels of liquid cooling systems are extremely susceptible to blockage by tiny particulate matter. Once the coolant is contaminated by particles, it will lead to heat dissipation failure and even component burnout. Therefore, the liquid cooling industry has imposed unprecedentedly stringent requirements on the cleanliness of components.

 

 

As a high-tech enterprise that has focused on technical cleanliness analysis for 16 years since 2010, XIENS relies on its independently developed patent technology matrix to provide the technical cleanliness solutions complying with international certifications such as VDA19.1 for high-end manufacturing sectors including liquid cooling and semiconductors, and has helped more than 1,000 enterprises worldwide achieve a leap in product yield.

 

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